{"id":6251,"date":"2010-08-04T17:16:17","date_gmt":"2010-08-04T14:16:17","guid":{"rendered":"http:\/\/www.fyysika.ee\/uudised\/?p=6251"},"modified":"2010-08-04T17:39:44","modified_gmt":"2010-08-04T14:39:44","slug":"ranist-komposiitmaterjal-sulab-tagurpidi","status":"publish","type":"post","link":"https:\/\/www.fyysika.ee\/?p=6251","title":{"rendered":"R\u00e4nist komposiitmaterjal sulab tagurpidi"},"content":{"rendered":"<p><strong>Teadlased Massachusettsi Tehnoloogiainstituudist avastasid hiljuti, et arvutikiipides ja p\u00e4ikeseelementides kasutatav r\u00e4ni sulab &#8216;tagurpidi&#8217;, kui see sisaldab suures koguses teatud metalle.<\/strong><\/p>\n<div id=\"attachment_6252\" style=\"width: 310px\" class=\"wp-caption alignleft\"><a href=\"http:\/\/www.fyysika.ee\/uudised\/wp-content\/uploads\/2010\/08\/100802110815-large.jpg\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-6252\" class=\"size-medium wp-image-6252\" title=\"100802110815-large\" src=\"http:\/\/www.fyysika.ee\/uudised\/wp-content\/uploads\/2010\/08\/100802110815-large-300x199.jpg\" alt=\"\" width=\"300\" height=\"199\" srcset=\"https:\/\/www.fyysika.ee\/wp-content\/uploads\/2010\/08\/100802110815-large-300x199.jpg 300w, https:\/\/www.fyysika.ee\/wp-content\/uploads\/2010\/08\/100802110815-large-250x165.jpg 250w, https:\/\/www.fyysika.ee\/wp-content\/uploads\/2010\/08\/100802110815-large.jpg 600w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/a><p id=\"caption-attachment-6252\" class=\"wp-caption-text\">Pisike r\u00e4nikiip(helendav oran\u017e ruuduke selle spetsiaalse seadme keskel) kuumutatakse r\u00e4ni sulamistemperatuurist palju v\u00e4iksema temperatuurini ning jahutatakse seej\u00e4rel aeglaselt maha. Kiip asetatakse otse s\u00fcnkrotonkiirguse teele, et uurida molekulaartasemel toimuvaid muutusi tagurpidise sulamise ajal. Pilt: Patrick Gillooly <\/p><\/div>\n<p>R\u00e4nist, vasest, niklist ning rauast valmistatud komposiitmaterjal &#8216;sulab'(muutub tahkest ainest vedela ja tahke aine seguks) temperatuuri langemisel alla 900 kraadi Celsiuse j\u00e4rgi, puhas r\u00e4ni ise sulab aga\u00a01414 kraadi Celsiuse juures. Madalamate temperatuuride t\u00f5ttu saab materjali k\u00e4itumist sulamise ajal j\u00e4lgida, kasutades selleks spetsiaalselt valmistatud r\u00f6ntgenkiirguse fluorestsents-mikroteraviku tehnoloogiat, mille allikaks on s\u00fcnkrotonkiirendi, vahendab <a href=\"http:\/\/www.sciencedaily.com\/releases\/2010\/08\/100802110815.htm\">sciencedaily.com<\/a>.<\/p>\n<p>Uurimuses saadud tulemused v\u00f5ivad osutuda kasulikuks m\u00f5ndade r\u00e4nip\u00f5histe seadmete tootmiskulude v\u00e4hendamisel, seda eriti just seesuguste seadmete puhul, millede kvaliteet s\u00f5ltub suuresti materjali puhtusest. MIT teadlaste uuritud materjalis kipuvad ebapuhtused\u00a0liikuma kaasa\u00a0vedela osaga, j\u00e4ttes j\u00e4rele puhtama r\u00e4ni. Sel viisil oleks v\u00f5imalik valmistada teisigi r\u00e4nip\u00f5hiseid seadmeid, n\u00e4iteks p\u00e4ikeseelemente, kasutades selleks odavamat ja v\u00e4hem puhast r\u00e4ni, mis tootmisprotsessis end ise puhastaks. Samuti v\u00f5iks uus tehnoloogia viia uute nanojuhtmete kimpude valmistamise meetoditeni.<\/p>\n<p><a href=\"http:\/\/www.sciencedaily.com\/releases\/2010\/08\/100802110815.htm\">Allikas<\/a><\/p>\n<p>Teadusartikkel &#8220;<a href=\"http:\/\/www3.interscience.wiley.com\/journal\/123595790\/abstract?CRETRY=1&amp;SRETRY=0\">Retrograde Melting and Internal Liquid Gettering in Silicon<\/a>&#8220;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Teadlased Massachusettsi Tehnoloogiainstituudist avastasid hiljuti, et arvutikiipides ja p\u00e4ikeseelementides kasutatav r\u00e4ni sulab &#8216;tagurpidi&#8217;, kui see sisaldab suures koguses teatud metalle. R\u00e4nist, vasest, niklist ning rauast valmistatud komposiitmaterjal &#8216;sulab'(muutub tahkest ainest vedela ja tahke aine seguks) temperatuuri langemisel alla 900 kraadi Celsiuse j\u00e4rgi, puhas r\u00e4ni ise sulab aga\u00a01414 kraadi Celsiuse juures. Madalamate temperatuuride t\u00f5ttu saab materjali [&hellip;]<\/p>\n","protected":false},"author":32,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_genesis_hide_title":false,"_genesis_hide_breadcrumbs":false,"_genesis_hide_singular_image":false,"_genesis_hide_footer_widgets":false,"_genesis_custom_body_class":"","_genesis_custom_post_class":"","_genesis_layout":"","footnotes":""},"categories":[31,16],"tags":[],"class_list":{"0":"post-6251","1":"post","2":"type-post","3":"status-publish","4":"format-standard","6":"category-rakenduslik-teadus","7":"category-teadusuudis","8":"entry","9":"has-post-thumbnail"},"_links":{"self":[{"href":"https:\/\/www.fyysika.ee\/index.php?rest_route=\/wp\/v2\/posts\/6251","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.fyysika.ee\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.fyysika.ee\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.fyysika.ee\/index.php?rest_route=\/wp\/v2\/users\/32"}],"replies":[{"embeddable":true,"href":"https:\/\/www.fyysika.ee\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=6251"}],"version-history":[{"count":0,"href":"https:\/\/www.fyysika.ee\/index.php?rest_route=\/wp\/v2\/posts\/6251\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.fyysika.ee\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=6251"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.fyysika.ee\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=6251"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.fyysika.ee\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=6251"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}