Correlated Three-Dimensional Imaging of Dislocations: Insights into the Onset of Thermal Slip in Semiconductor Wafers

Author(s): D. Hänschke, A. Danilewsky, L. Helfen, E. Hamann, and T. Baumbach

A combination of imaging techniques provides an unprecedented 3D view of a network of crystal defects known as dislocations.

[Phys. Rev. Lett. 119, 215504] Published Mon Nov 20, 2017